This year, we have moved forward on sample prep challenges with a focus on copper. It has been a very active workshop (questions and answers). The following presentations introduced the debates:

• Welcome / questions
• Overview of copper challenges, an intro (Infineon Germany)
• Topic 1, Chip access: "Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices”, Michael Obein (Digit Concept France)
• Topic 2, Cu as part of the defect: "Copper dendrites growth in package: physical isolation and characterization”, Giuseppe GIUGA (STM Italy)
• Topic 3, prep techniques for preservation of grain structure, Metallography issues, "A comparison of preparation techniques for Cu filled TSV characterization", Frank Altmann
• Fraunhofer Institute for Mechanics of Materials, Halle, Center for Applied Microstructure Diagnostics (CAM)
• Open questions
• Wrap up

Questions and statements to these topics are welcome. In order to introduce into a fruitful discussion, the EUFANET moderator will group and present  them and then handover the floor to the attendees for further and open contributions.  Please send your questions/ remarks to Philippe.perdu@cnes.fr no later than September 27

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