Workshop purpose

 

 

3D integration is a key new trend for microelectronics. At system level, it allows incredible heterogeneous System in Packages with sensors, power, analog, digital and wireless possibilities. For Integrated Circuit manufacturer, the third dimension gives opportunities to stack dies by using 3D interconnections with Through Silicon Vias. In order to fully benefit from these new technologies challenges have to be overcome. It comprises:

Design (including design for test, design for manufacturing, design for reliability, design for failure analysis),

Manufacturing,

Electrical test,

Reliability test

Characterization and Reliability challenges

Failure analysis.

 

The aim of this workshop is to mix skills coming from involved industries. Contributions on all these topics are welcome. A specific focus will be on characterization and analysis:

Sample preparation (chip access, repackaging, cross sectioning, ...)

Acoustic microscopy,

Xray (2D, Computed Tomography),

Magnetic Microscopy,

Time Domain Reflectometry,

Thermal measurements, hot spot localization,

Terahertz imaging,

Holography, 3D optical,

High resolution electron and ion microscopy (SEM, TEM, HIM, TOFSIMS),

Thermo mechanical simulation and measurements

...

 

 

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