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Circuit Scan 1000, from
Micro Magnetics, is a high-resolution magnetic microscope which provides
current density images of operating integrated circuits (ICs). This product
family has found utility for failure analysis, fault isolation, and yield
enhancement of ICs.
emmi
Photon Emission Detection,
QFI. QFI's emmi photo-emission microscope is equipped with extremely sensitive
detectors and lenses, and is housed in light tight enclosures. The detectors are
cooled to reduce noise and dark-current and they are capable of detecting the
faintest emissions.
EmiScope product
line , Credence, is a family of time resolved emission microscopes enabling picoseconds
resolution and high bandwidth timing measurement.
IREM product
line, Credence, is a family of backside infrared emission microscope with unprecedented
sensitivity and spatial resolution.
Infrascan 200,
from CHECKPOINT Technologies, is a fully integrated, computer-controlled tool that localizes
faults over a wide range of IC devices.
InfraScope
Hot Spot Detection,
QFI . Infrascope III can perform infrared hot-spot detection and isolation for front or backside
inspection.
Laser Signal
Injection,
QFI. Laser Signal Injection Microscopy (LSIM) is a backside inspection tool
to locate defects on large scale integrated circuits.
PHEMOS-1000,
HAMAMATSU. The Phemos-1000 emission microscopy detects
and precisely locates abnormal phenomena such as internal
breakdown from ESD failure, leakage, hot-carrier generation,
and latch-up. The Phemos-1000 laser penetrates layers
of the wafer without the need for polishing to disclose
even the tiniest defects.
Scanning Optical
Microscope System,
SEMICAPS SOM. References list.
THEMOS-100,
HAMAMATSU. The THEMOS series are thermal emission monitoring systems
which are designed for failure analyses of electrical components using an
infrared camera. The THEMOS-100 is a wafer-probing model.
μAMOS,
HAMAMATSU. μAMOS is an advanced semiconductor failure
analyzer because it employs IR-OBIRCH, the most advanced
detection technique. IR-OBIRCH detects leakage current
and abormal resistance via contacts faseter and more
clearly than other mothod. Its exceptional spatial resolution
and 100X magnification ensure the most precise analysis
of wafers as well as chips up to 15x15 mm.
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