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Fault localization:                                              Tools List

Circuit Scan 1000, from Micro Magnetics, is a high-resolution magnetic microscope which provides current density images of operating integrated circuits (ICs). This product family has found utility for failure analysis, fault isolation, and yield enhancement of ICs.

emmi Photon Emission Detection, QFI. QFI's emmi photo-emission microscope is equipped with extremely sensitive detectors and lenses, and is housed in light tight enclosures. The detectors are cooled to reduce noise and dark-current and they are capable of detecting the faintest emissions.

EmiScope product line , Credence, is a family of time resolved emission microscopes enabling picoseconds resolution and high bandwidth timing measurement.

IREM product line, Credence, is a family of backside infrared emission microscope with unprecedented sensitivity and spatial resolution.

Infrascan 200, from CHECKPOINT Technologies, is a fully integrated, computer-controlled tool that localizes faults over a wide range of IC devices.

InfraScope Hot Spot Detection, QFI . Infrascope III can perform infrared hot-spot detection and isolation for front or backside inspection.

Laser Signal Injection, QFI. Laser Signal Injection Microscopy (LSIM) is a backside inspection tool to locate defects on large scale integrated circuits.

PHEMOS-1000, HAMAMATSU. The Phemos-1000 emission microscopy detects and precisely locates abnormal phenomena such as internal breakdown from ESD failure, leakage, hot-carrier generation, and latch-up. The Phemos-1000 laser penetrates layers of the wafer without the need for polishing to disclose even the tiniest defects.

Scanning Optical Microscope System, SEMICAPS SOM. References list.

THEMOS-100, HAMAMATSU. The THEMOS series are thermal emission monitoring systems which are designed for failure analyses of electrical components using an infrared camera. The THEMOS-100 is a wafer-probing model.

μAMOS, HAMAMATSU. μAMOS is an advanced semiconductor failure analyzer because it employs IR-OBIRCH, the most advanced detection technique. IR-OBIRCH detects leakage current and abormal resistance via contacts faseter and more clearly than other mothod. Its exceptional spatial resolution and 100X magnification ensure the most precise analysis of wafers as well as chips up to 15x15 mm.

 

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