ASAP-1, from ULTRA TEC, is the standard piece of sample preparation equipment used for backside preparation and is already widely positioned in many FA labs.

Chip UnZip Backside Preparation. Chip UnZip is a tool for package removal and backside die thinning on all kinds of material.

DigitConcept. It provides microelectronics & high tech equipment. Their produits include: Thermal Chucks, Component adapters, Plasma cleaning,  Plasma RIE, Decapsulation, Silicon thinning, Sample preparation, Acoustic Microscopy, SOM PEM, and Accessories, Services.

DCap Delta2i, from Nisene Technology, is able to remove the encapsulant while preserving the integrity of the die, wires and leadframe. For decapsulation of DIP, SO, QFP, BGA’s, Smart cards, etc.

EM2 for TEM/SEM Sample Preparation, SELA. A dedicated, automated, timesaving and user-friendly system that enables a total solution for TEM/STEM and SEM  sample preparation for both cross section and plan view in a wide range of applications. Featuring a cryo-cooled, dry sawing process, the EM2 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.

Focused Ion Beam (FIB), is a Dual Beam machine (FEI StrataTM DB 235) combining a high-resolution FIB column equipped with a Ga Liquid Metal Ion Source (LMIS) and an SEM column equipped with a Schottky Field Emission Gun (SFEG) electron source. FIB offers the ability to design, sculpt or pattern nano- and micro-structures on different materials with spatial resolution down to 20 nm.

MultiEtch System is dedicated to back side thinning of silicon circuits, allowing back side emission microscopy technics to be used. Its propriteies: Use of mixed acids (nitric/fluoridric); Silicon thinning up to 10 µm with no mechanical nor thermal stress; and CE certified.

MC600 for SEM Sample Preparation, SELA. The MC600 System has been designed to allow fully automatic, reliable, and speedy cross-sectioning of both integral die and wafer-level samples. An innovative approach facilitates processing of segments down to a minimum size of 4.5 x 4.5 mm, which also allows cross-sectioning of edge dies. Dedicated software enables automatic mapping and planning of a single or multiple targets and features automatic off-loading for immediate inspection. The in-line cryo-cooling (liquid nitrogen) option is available for certain applications. This accessibility, together with high throughput (under 9 min/sample), high accuracy (less than 0.5 micron), and excellent quality of cross-sections, significantly reduces the diagnostic cycle for both failure analysis and process monitoring.

Precision IC Cross-Section Kit, UltraTest International Inc. The UTI Precision IC Cross-Section Kit is the premier tool for preparing cross-section samples of Integrated Circuits.  It may be used with any grinding/polishing machine.

Parallel Lapping Kit,  Parallel Lapping Kit, UltraTest International Inc. The UTI Parallel Lapping Instrument is the tool for removing layers of a die with precision, without subjecting the sample to chemicals or plasma.

*****Sample preparation tools, DigitConcept. The FA2000 RIE from BSET EQ is a fully programmable tabletop machine. It is applicable for : IC’s delayering and passivation removal; Plastic package decapsulation (option on FA2000-P); Material etching; and R&D, failure analysis.

Sectioning products at ALLIED, High Tech Products, Inc. Product including sectioning machine, low speed saw, wafering blades, diamond band saw, trim saw, cutting fluids, abrasive cut-off saw, abrasive cut-off blabes.

TEMpro for TEM/FIB Sample Preparation. The SELA TEMpro allows automatic, reliable, and rapid TEM sample pre-preparation. This stand-alone unit produces a sample thinned to 20 microns in 15 minutes and features the capability to control and program the target location within this width. The entire process is dry. The completed sample is packaged for direct loading into both a FIB workstation and TEM holder.

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