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Physical Characterization :                             Publications List

Application of focused ion beam techniques and transmission electron microscopy to thin-film transistor failure analysis, by Satoshi Tsuji, Katsuhiro Tsujimoto, Kotaro Kuroda and Hiroyasu Saka

Dry Etching Considerations for Copper Metallizations, by VV. Makarov, T. Lundquist, W. Thompson, D. Griffins, P. Russell, AVS 4th International Conference on Microelectronics and Interfaces, March 2003.

Electron Microscopy Analysis, EMSL Analytical, Inc. A brief description of electron microscopy analysis, including TEM,EDX and SEM.

Electrical Characterization with Scanning Probe Microscopes (AN79)

IBM microelectronics Scanning Electron Microscopy. The description of technique and some instrument models are given in the articile, such as, Hitachi S-900, JOEL 6400F and Hitachi S4000.

Nikon MicroscopyU Microscope, Optical Systems, contributing authors : Kenneth R. Spring, Matthew Parry-Hill, Michael W. Davidson. Three sections are included: Microscope Optical Systems, Interactive Java Tutorials, Optical Aberrations Interactive Java Tutorials.

Scanning Electron Microscopy, provides a very complete coverage of basics and written for a wide audience. It includes principles of the method, practical aspects of the method, method automation, data analysis and initial interpretation, sample preparation and specimen modification.

Scanning Probe/Atomic Force Microscopy, technology overview.

X-Ray Photoelectron Spectroscopy (XPS or ESCA), IBM. The information on Technique, Instrument Model, Tool capability and Sample size are included.

 

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