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While most advanced semiconductor companies have reached the 28nm CMOS technology node in manufacturing recently, their leading edge products in conjunction with 3D chip integration, advanced packaging and organic based electronics are entering the consumer market. The introduction of new materials into these products is one of the foremost drivers to enable new functionalities and advantages. In order to support this, analytical techniques for process and materials characterization and failure analysis are challenged to cope with shrinking feature sizes, new failure and degradation modes. In an increasing number of cases, thin films and structures have to be studied on the atomic scale. Techniques like TEM, 3D Atom Probe and AFM-based methods are essential to find root causes of degradation and failure and consequently to ensure quality and product reliability. But also the conventional imaging, preparation and microsurgery techniques need to be kept up-to-date to allow conclusive investigations.

The workshop is aimed to offer an opportunity for exchanging ideas, sharing experiences, meeting experts who are involved in R&D of analytical tools at the supplier and the user site. It will especially address todays and future challenges to failure analysis in a large variety of products/applications ranging from silicon-based to organic and advanced carbon-based electronics. Perspectives on upcoming developments will be discussed, like:

• Overview on new devices concepts: transistors, memories, sensors, etc. and their manufacturing aspects
• Advanced or “exotic” materials either within the classical silicon-based technologies or as standalone product (organics, carbon-based)
• Preparation for failure analysis for the above mentioned
• Failure analysis cases – which FA methods address which FA cases
• Imaging techniques: optical-, ion- and electron-beam based, scanning probe …
• Material characterization: elemental, structural, chemical analysis
• Reliability and characterization challenges, paradigm changes due to new materials
• State of the art for ESD, limits and solutions.

The covered topics will highlight the new trends as well as the role and the limits of failure analysis for nanotechnologies or emerging materials.

Workshop on “Smart Failure Analysis for New Materials in Electronic Devices” will be held on Monday September 17th (9:00 am – 6:30 pm) and Tuesday September 18th in 2012 (8:30 am – 6:00 pm) at the Fraunhofer CNT, Königsbrücker Strasse 180, 01099 Dresden, Germany.

You are kindly invited to contribute to the Workshop on “Smart Failure Analysis for New Materials in Electronic Devices” (trends, challenges and solutions for tomorrow’s analysis of new technologies, materials and products). Send your submission before July 30 at smartFA@eufanet.org